The chip equipment maker is working with NUS and SIT to speed process development and train engineers for automated ...

A new tabletop-sized device developed by engineers at the University of Texas at Austin could dramatically speed up ...

As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ...

Indian semiconductor firm Netrasemi has launched its maiden 12nm AI chip, A2000, and announced it plans to start commercial ...

The chip industry is the most complex that you could imagine, and quantum computing, intrinsically, is based on some of the ...

China has unveiled the Z-21, a heavy attack helicopter that military analysts are comparing ...

Researchers may have unlocked the future of computing by turning flat silicon chips into densely stacked 3D architectures.

China's Hua Hong Group has developed advanced chipmaking technologies that can be used to make AI chips, Reuters reported, citing four people with knowledge of the matter. The company's contract ...

Researchers at the University of Illinois Urbana-Champaign have developed a way to stack high-performance ...

ALPHABET’S Google is in talks with Samsung Electronics to manufacture part of its next-generation artificial intelligence (AI) processor, The Information reported on Thursday, citing two people ...

The National Network for Microelectronics Education (NNME), funded by CHIPS funding at the National Science Foundation and ...